Packaging Design Engineer Jobs in Hyderabad - Xilinx Inc.

Packaging Design Engineer
Xilinx Inc.
Any Graduate
Packaging Design Engineer Jobs in Hyderabad - Xilinx Inc.
Last Date 31 May 2020
This Job is Expired

Xilinx Inc. - Job Details

Date of posting: 01 Apr 20
Packaging Design Engineer
Hyderabad, India, India

Job requirements :  

  • Experience in CADENCE Allegro Package Designer, including constraints setup
  • Familiarity with AutoCAD, Gerber/ODB++/GDSII conversion software, and DFM tools
  • Knowledge in packaging substrate structures and manufacturing
  • Knowledge in 2.5D/3D, flipchip, WLP and wirebond assembly and reliability
  • Knowledge in SPICE, signal/power integrity, DDR3/4, and SerDes channel modeling for high speed design

Education Requirements : Bachelors with 4+ years or Masters in EE or related fields

Years of Experience : A minimum of 2 years of relevant experience in advanced package design

Job Summary

Job Type : Full Time
Job Category : IT/Software
Hiring Process : Face to Face Interview
Who can apply : Freshers

About Xilinx Inc.

Xilinx is the inventor of the FPGA, programmable SoCs, and now, the ACAP. Our highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud. Xilinx delivers the most dynamic processing technology in the industry, enabling rapid innovation with its adaptable, intelligent computing.
This Job is Expired
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Xilinx Inc. recruiting Packaging Design Engineer candidates nearby Hyderabad.Xilinx Inc. vacancies for Packaging Design Engineer is recruited through Written-test, Face to Face Interview etc.
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