Packaging Design Engineer Job in Xilinx Inc. at Hyderabad

Packaging Design Engineer

Xilinx Inc.

Not disclosed

Expired

Posted: 01 Apr 20

Job Description

Packaging Design Engineer

158426

Hyderabad, India, India

Job requirements :

Experience in CADENCE Allegro Package Designer, including constraints setup
Familiarity with AutoCAD, Gerber/ODB++/GDSII conversion software, and DFM tools
Knowledge in packaging substrate structures and manufacturing
Knowledge in 2.5D/3D, flipchip, WLP and wirebond assembly and reliability
Knowledge in SPICE, signal/power integrity, DDR3/4, and SerDes channel modeling for high speed design

Education Requirements : Bachelors with 4+ years or Masters in EE or related fields

Years of Experience : A minimum of 2 years of relevant experience in advanced package design

Job Particulars

Role it software engineer

Education Any Graduate

Who can apply Freshers

Hiring Process Face to Face Interview

Employment TypeFull Time

Job Id907482

Job Category IT/Software

Locality Address

State Telangana

Country India

About Company

Xilinx is the inventor of the FPGA, programmable SoCs, and now, the ACAP. Our highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud. Xilinx delivers the most dynamic processing technology in the industry, enabling rapid innovation with its adaptable, intelligent computing.

Jobs By Location

Hyderabad

Chennai

Pune

Noida

Bangalore

Gurgaon

Kolkata

Ahmedabad

Delhi

Mumbai