Packaging Design Engineer Jobs in Hyderabad - Xilinx Inc.
Packaging Design Engineer
Xilinx Inc.
Expired
Posted: 01 Apr 20
Job Description
Packaging Design Engineer
158426
Hyderabad, India, India
Job requirements :
- Experience in CADENCE Allegro Package Designer, including constraints setup
- Familiarity with AutoCAD, Gerber/ODB++/GDSII conversion software, and DFM tools
- Knowledge in packaging substrate structures and manufacturing
- Knowledge in 2.5D/3D, flipchip, WLP and wirebond assembly and reliability
- Knowledge in SPICE, signal/power integrity, DDR3/4, and SerDes channel modeling for high speed design
Education Requirements : Bachelors with 4+ years or Masters in EE or related fields
Years of Experience : A minimum of 2 years of relevant experience in advanced package design
Job Particulars
Role it software engineer
Education Any Graduate
Who can apply Freshers
Hiring Process Face to Face Interview
Employment TypeFull Time
Job Id907482
Job Category IT/Software
Locality Address
State Telangana
Country India
About Company
Xilinx is the inventor of the FPGA, programmable SoCs, and now, the ACAP. Our highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies - from consumer to cars to the cloud. Xilinx delivers the most dynamic processing technology in the industry, enabling rapid innovation with its adaptable, intelligent computing.
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